Samtec Inc. will showcase and demonstrate their latest high-performance interconnect and technologies at DesignCon 2019 in Santa Clara, CA.
Samtec high-speed technologies for Silicon-to-Silicon optimization will be on display, including new high-speed, high-bandwidth optical, board-to-board and cable-to-board interconnects, 56 Gbps PAM4 and 112 Gbps PAM4 product demonstrations will also be highlighted. Samtec signal integrity experts will present papers, technical sessions, and tutorials on a variety of SI topics during the three-day conference.
Samtec is a privately held, $822 MM global manufacturer of a broad line of electronic interconnect solutions, including High-Speed Board-to-Board, High-Speed Cables, Mid-Board and Panel Optics, Precision RF, Flexible Stacking, and Micro/Rugged components and cables. With 40+ location severing approximately 125 countries, Samtec’s global presence enables its unmatched customer service.
