Micron Technology unveiled memory and storage innovations across its portfolio based on its industry-leading 176-layer NAND and 1α (1-alpha) DRAM technology, as well as the industry’s first Universal Flash Storage (UFS) 3.1 solution for automotive applications. The new portfolio additions deliver on the company’s vision of accelerating data-driven insights through innovations in memory and storage that enable new capabilities from the data center to the intelligent edge. Micron President and CEO Sanjay Mehrotra made the announcements during a Computex keynote, in which he shared a sweeping vision for computing innovation and the central role memory and storage play in enabling enterprises to seize the full potential of the data economy.
“Memory and storage and becoming central tp platform innovation. Micron is the world’s 4th largest semiconductor industry leader in innovative memory and storage solutions and the largest investor in Taiwan. Our memory & storage innovations have been the heart of creating trends. Today’s technology is driven by data that makes the industry more accessible, effective and more useful. Ms Kinsey projects that advanced data analytics & technologies will add $13 trillion dollars by 2030. “ says Mr Mehrotra .
Micron announced volume delivery of its first PCIe® Gen4 solid-state drives (SSDs) built with the world’s first 176-layer NAND. The company is also shipping the world’s first 1α node-based LPDDR4x DRAM this month. LPDDR4x is the latest JEDEC specification for fourth-generation low-power DRAM with improved input/output voltage for substantially lower power, making it ideal for mobile computing devices. Together, these latest releases reinforce Micron’s leadership position in both DRAM and NAND technology, established this year.
“As artificial intelligence and 5G reach mainstream deployment, they are creating dramatic new potential for data in the post-pandemic world,” Mehrotra said. “This transformation presents an opportunity for accelerating innovation to address customer needs. Today we are debuting new memory and storage solutions that accelerate innovation, from powerful data center servers and faster client devices to intelligent vehicles at the edge.”
Micron PCIe Gen4 SSD portfolio is designed to tackle demanding client applications-The company’s latest SSDs, the Micron 3400 and 2450, deliver high performance and design flexibility with low power consumption to enable all-day use from professional workstations to ultrathin notebooks. The Micron 3400 SSD provides twice the read throughput and up to 85% higher write throughput,1 unleashing demanding applications like real-time 3D rendering, computer-aided design, gaming and animation. For customers seeking the best value with PCIe Gen4 performance, the Micron 2450 SSD delivers a highly responsive user experience for everyday use. The 2450 SSD is available in three form factors, as small as the 22 x 30mm M.2, to deliver immense design flexibility.
Micron ships world’s first 1α-based LPDDR4x and DDR4, now in volume production-Micron is shipping LPDDR4x in volume on its leading 1α node this month, quickly following the introduction of initial 1α node DRAM products in January 2021. The company has also completed validation of its 1α-based DDR4 on leading data center platforms, including 3rd Generation AMD EPYC. Both are in volume production in Micron’s advanced DRAM fabrication facilities in Taiwan, including its newly established A3 facility in Taichung.
Micron delivers ruggedized storage engineered for data-intensive automotive systems-Bringing innovation to the intelligent edge, Micron announced that it is sampling 128GB and 256GB densities of its 96-layer NAND as part of its new portfolio of UFS 3.1 managed NAND products for automotive applications. With infotainment systems evolving to include high-resolution displays and human-machine interface capabilities based on artificial intelligence (AI), Micron’s UFS 3.1 portfolio provides much-needed high-throughput and low-latency storage
