MediaTek, the world’s fourth-largest fabless semiconductor company, today announced its collaboration with Tessolve, a Hero Electronix venture and an end-to-end engineering solution partner for semiconductor and product companies, to accelerate the development of an Edge-AI Enabled Smart Device Eco-system. Tessolve launched the MAGIK2 family nano System on module (SoM) & evaluation board powered by MediaTek i500 to power Next-gen AI Smart Devices with high-performance edge processing, advanced multimedia capabilities, multiple high-resolution cameras, AI-enabled kiosks (advertising signage platforms), connected touchscreen displays, and multitasking OS.
“MediaTek is an industry leader in developing powerful, highly integrated and efficient system-on-chip products. We are enabling the future of AI, by creating an ecosystem of Edge-AI hardware processing paired with comprehensive software tools across our product range, including smartphones, smart homes, wearables, IoT and connected cars. Our collaboration with Tessolve will power advanced AI-enabled devices and premium experiences, along-with reducing development costs and accelerating the time to market,” said Raghavan Sampath, Director – Business Development, MediaTek.
TessolveSoM also supports the common SDK software from BayLibre, MediaTek’s software scaling partner. This single SDK across all AIoT Hardware platforms accelerates time to market for customers and comes with a long term support.
“As part of Tessolve’s strategy to provide value add solutions to our customers, we aligned with MediaTek to develop a System on Module to address the growing needs in building AI-enabled edge computing system solutions. The collaboration will enable the roll-out of production-ready AIoT hardware and Android software to help customers reduce their product development cycle time from design to manufacturing of portable, home and commercial IoT applications.” said Sunil Walia, SVP of Sales & Marketing, Tessolve.
